JPH0260258U - - Google Patents
Info
- Publication number
- JPH0260258U JPH0260258U JP14008188U JP14008188U JPH0260258U JP H0260258 U JPH0260258 U JP H0260258U JP 14008188 U JP14008188 U JP 14008188U JP 14008188 U JP14008188 U JP 14008188U JP H0260258 U JPH0260258 U JP H0260258U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- substrate
- mounting
- conductor circuit
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims 1
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14008188U JPH0260258U (en]) | 1988-10-26 | 1988-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14008188U JPH0260258U (en]) | 1988-10-26 | 1988-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260258U true JPH0260258U (en]) | 1990-05-02 |
Family
ID=31403928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14008188U Pending JPH0260258U (en]) | 1988-10-26 | 1988-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260258U (en]) |
-
1988
- 1988-10-26 JP JP14008188U patent/JPH0260258U/ja active Pending